metallization AmE , also: metallisation BrE

The same metallization is used for other switch tubes as well.

In the picture on the right hand side, such a metallization formed into a "T" pattern is shown.

The burning process is followed by a cleaning and then the outer metallization of both end surfaces.

The metal particles of this track form the nuclei for the subsequent metallization.

Techniques for metallization started as early as mirror making.

On the ceramic layer, the electrodes of the capacitor are deposited by metallization.

Prior to the Mercury Probe, a sample had to undergo a metallization process, which could take hours.

In his patent, Kilby also mentions the use of metallization layer.

This technology combines plastic substrate/housing with circuitry into a single part through selective metallization.

Another technique to increase the surge current rating for film capacitors is a double-sided metallization.

Various strategies are used, from guard rings to overlaps of metallization to spread out the field gradient.

Copper-based front-side metallization in silicon solar cells is a significant step towards lower cost.

Mitring the bend reduces the area of metallization, and so removes the excess capacitance.

A very thin ( 0.03 m) vacuum-deposited aluminum metallization is applied to one or both sides to serve as electrodes.

Each of these "T" patterns produces a deliberately narrowed cross-section in the conductive metallization.

This technique is analogous to the "T metallization" technique described above, but operating at a larger physical scale.

The outstanding metallization of the electrodes at two sides of the body are then contacted with the contacting terminal.

They are manufactured both as metallized and as film/foil types, although poor adherence to the film makes metallization difficult.

The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the electronics industry.

The "pinholes" in the metallization caused by the self-healing arcs reduce the capacitance of the capacitor very slightly.

Double-sided metallized films also can be combined with internal series-connected capacitors by partial metallization.

Via-last TSVs are manufactured after metallization and pass through the chip.

Stress Migration is a failure mechanism that often occurs in IC metallization (aluminum, copper).

His group concentrates on new technologies such as metallization and laser-chemical processing techniques in silicon solar cell production and research.

The actual procedure needs to be adapted to every application and device because of usually existing interconnects and metallization systems on the wafer.