passivate

Care must be taken to passivate all surfaces frequently and to exclude any water or greases.

Aluminium anodes will passivate where chloride concentration is below 1,446 parts per million.

The sulfurization step appears to passivate the surface in a way similar to CdS in most other cells.

Bare metals are a little tough to passivate without increasing the emissivity at thermal wavelengths in the far infra-red.

There are three main ways to passivate these alloys: alclading, chromate conversion coating and anodizing.

The interface between the core and shell can be tailored to passivate relaxation pathways and form radiative states.

Tannic acid is used in the conservation of ferrous (iron based) metal objects to passivate and inhibit corrosion.

Such materials react with the metal contaminants and passivate the contaminants by forming less harmful compounds that remain on the catalyst.

Surface-bound organic ligands are typically used to coordinate to surface atoms having reduced coordination number in order to passivate the surface traps.

The phosphoric acid content helps to passivate ferrous alloys against corrosion by the dilute nitric acid.

Pilling-Bedworth ratio, a crystallographic ratio used to estimate if the metal is likely to passivate in dry air from creation of a protective oxide layer.

It is relevant to Chromate conversion coating, which is used to passivate common metal alloys such as aluminum, zinc, cadmium, copper, silver, magnesium, and tin.

The simplest adjustment involves control of pH and alkalinity to produce a water that tends to passivate corrosion by depositing a layer of calcium carbonate.

The majority of parylene used is deposited as passivation coatings to passivate the part or device towards moisture, chemical attack or as a dielectric insulator.

Often, the metal (such as aluminium, iron, or copper) must be powdered because many metals passivate by forming protective layers of the metal fluoride that resist further fluoridation.

The two-terminal cell has advantages such as a smaller cell size, better scalability to sub-20 nm nodes (see semiconductor device fabrication), and the ability to passivate the memory cell during fabrication.

However, proprietary passivation processes exist for martensitic stainless steel, which is difficult to passivate, as microscopic discontinuities can form in the surface of a machined part during passivation in a typical nitric acid bath.

The Al and Cr form oxide layers that passivate the surface and protect the superalloy from further oxidation while B and Y are used to improve the adhesion of this oxide scale to the substrate.

To apply this technique for the production of small patterned features it is necessary that the surface can be reacted to passivate it in the area exposed by the channel, followed by etching and then reacted in away that will only occur in the newly exposed area.

While Bower's idea was conceptually sound, in practice it did not work, because it was impossible to adequately passivate the transistors, and repair the radiation damage done to the silicon crystal structure by the ion implantation, since these two operations would have required temperatures in excess of the ones survivable by the aluminum gate.